Meta has secured a major deal for Amazon’s homegrown CPUs to power AI agentic workloads, rather than relying on GPUs. The move suggests companies are shifting the chip battlefield beyond accelerators toward general-purpose processing engineered for AI tasks. As demand for agentic systems grows, this CPU-driven sprint could redraw how the next generation of AI infrastructure is built.
Intel’s upbeat Q2 outlook, powered by strong demand for AI-focused server chips, beat expectations and lifted investor confidence. The company forecast revenue of $13.8–$14.8 billion and also delivered better-than-expected earnings guidance. Shares jumped about 19% in extended trading, adding roughly $64 billion in market value, as CEO Lip-Bu Tan pushes a turnaround plan of cost cuts, asset sales, and partnerships.
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Korean on-device AI chip startup DeepX is preparing for an initial public offering after completing its current funding round in the first half of the year, CEO Lokwon Kim told Reuters. The company plans to appoint IPO banks once that financing wraps up, and its work with Hyundai Motor and Baidu highlights growing commercial traction for on-device AI hardware.
TSMC plans to open its first advanced chip packaging plant in an existing Arizona facility, with an executive pointing to 2029. The move targets advanced packaging techniques that join multiple components into modern AI chips. TSMC said it is seeking permits to start construction but has not specified when output will begin, raising expectations for supply relief.
Australian AI hardware startup Syenta has raised $26 million to scale a new chip manufacturing approach designed to ease AI supply bottlenecks. The firm plans to open an Arizona office and aims for high-volume production by 2028. Former Intel CEO Pat Gelsinger has joined Syenta’s board, signaling strong industry backing for faster chip connectivity and improved availability.
Huawei says its Ascend supernode powered by Ascend 950 AI chips will fully support Deepseek’s V4 model variants after the Chinese AI startup released a preview. The announcement positions Huawei’s hardware stack as a near-term platform for Deepseek’s next generation, signaling escalating competition in China’s domestic AI compute ecosystem.
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Marvell shares rose after a report said it is in talks with Google to develop two AI chips. The Information, citing people close to the discussions, suggests Marvell could supply a memory processing unit to complement Google’s tensor processing unit, alongside a new TPU designed to run AI models. The report points to a potential expansion of Google’s custom AI hardware.
Elon Musk says Tesla’s Terafab AI chip project in Texas will use Intel’s 14A process. The planned complex, beginning early research fab construction at Giga Texas, targets chips for Tesla vehicles, Optimus robots, and AI data centers. If timelines hold, it signals Tesla’s push to control its compute supply for both products and future AI workloads.
AMD shares are climbing quickly and breaking above the $300 mark as surging AI chip demand meets fresh analyst upgrades and optimistic price targets. Support is also coming from a broader semiconductor upcycle and continued spending by major tech firms. Investors are now focused on AMD’s upcoming earnings, which could confirm the rally—or signal a slowdown.
Nvidia’s H200 AI chips have not reached Chinese companies, according to US Commerce Secretary Howard Lutnick. He said China’s central government has not permitted the sales, aiming instead to steer investment toward domestic industry. Shipments also stalled amid disputes over sales terms. Meanwhile, the US is reportedly weighing new rules to restrict advanced tech shipments to Chinese firms.
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Thousands of Samsung Electronics workers rallied at the company’s chip complex in Pyeongtaek, South Korea, calling for higher bonuses and warning of a potential strike. The labor action comes as AI-driven demand lifts memory-chip profits, intensifying pressure on management as workers seek a larger share of the windfall.
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