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TSMC eyes advanced chip packaging plant in Arizona by 2029 to ease AI chip bottleneck
Technology
Published on 24 April 2026
It targets the “glued” multi chip bottleneck first
TSMC plans to open its first advanced chip packaging plant in an existing Arizona facility, with an executive pointing to 2029. The move targets advanced packaging techniques that join multiple components into modern AI chips. TSMC said it is seeking permits to start construction but has not specified when output will begin, raising expectations for supply relief.
- TSMC plans advanced packaging in an Arizona facility
- Target timeline mentioned: 2029, while permits are underway
- Advanced packaging has become a supply bottleneck for AI chips
- Focus is on multi component “glued” chip construction
Read the full story at The Economic Times
This summarization was done by Beige for a story published on 
The Economic Times